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This project dealt with advanced LTCC systems with embedded passive
components. LTCC (Low Temperature Co-fired Ceramics) is utilised to build 3D circuit boards by
laminating a certain number of green ceramic tapes with electrode patterns and co-fire the same at
a low temperature, about 850°C. There are several advantages of LTCC
compared to conventional PCB (Printed Circuit Board). The size of the LTCC board can be reduced considerably because of the 3D
structure and passive components such as capacitors, inductors and resistors can be embedded, which
facilitates a high degree of integration. A schematic design of a LTCC board is shown below.
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